책소개
이 책은 반도체 패키지와 테스트의 입문서입니다. 반도체 업계에 입문하려는 학생들에게는 방향을 제시하는 지침서의 역할을 하 게 될 것입니다. 또한 패키지와 테스트 관련 업무에 종사하는 분들과 유관 업무를 하고 계신 분 들에게는 이해도를 향상시켜드리게 될 것입니다. 나아가 패키지, 테스트의 장비와 소재를 만드는 분들에게도 이 책의 지식들이 해 당 업무의 효율을 높이는 데 기여할 것이라 생각됩니다.
제1장에서는 테스트 장비와 프로세스, 대략적인 테스트 항목에 대해 설명하였고, 제2장에서는 패키지의 정의와 역할, 기술 개발 트렌드, 기술 개발 프로세스 등을 설 명하였습니다. 제3장에서는 패키지의 종류를 분류하고, 각 종류별 특징, 장단점 등을 기술하였습니다. 제4장에서는 패키지 설계와 해석을 설명하였는데, 패키지 설계와 칩 설계의 차이점을 알리고, 설계 및 공정 효율을 높이기 위한 구조, 열, 전기 해석 내용과 과정 을 소개하였습니다. 제5장은 패키지 공정을 설명하는 장인데, 종류별 공정 순서와 각 공정들의 진행방 법과 의미를 소개하였습니다. 제6장에서는 패키지 공정 진행을 위해서 사용되는 재료들을 소개하였고, 제7장에서는 품질과 신뢰성의 의미 및 신뢰성 평가 항목들의 진행 방법과 목적을 설명하였습니다.
저자소개
저자 : 서민석
저자 : 서민석
서민석 박사는 한국과학기술원 재료공학과에서 학사,석사 학위를 취득하였고, 반도체 패키지를 위한 전해 도금 공정 및 재료 연구로 박사학위를 취득하였다.
이후 SK하이닉스 반도체에서 SRAM & Flash 공정 개발에 참여하였다가 2003년부터 반도체 패키지 개발 부서에서 RDL, Flip Chip, Fan in WLCSP, TSV(HBM, 3DS, Wide IO)등의 Wafer Level Package 개발을 주관하였다.
목차
01 반도체
테스트의 이해
01. 반도체 후공정 ······················································ 5
02. 테스트의 종류······················································ 8
03. 웨이퍼 테스트 ···················································· 10
EPM ································································ 13
웨이퍼 번인······················································· 13
테스트 ····························································· 14
리페어······························································ 15
04. 패키지 테스트 ···················································· 16
TDBI································································ 17
테스트 ····························································· 18
외관 검사·························································· 18
02 반도체
패키지의 정의와 역할
01. 반도체 패키지의 정의········································· 25
02. 반도체 패키지의 역할 ········································ 26
03. 반도체 패키지의 개발 트렌드····························· 28
04. 반도체 패키지 개발 과정 ··································· 31
03 반도체
패키지의 종류
01. 반도체 패키지의 분류······················································ 39
02. 컨벤셔널 패키지·······························································41
플라스틱 패키지 - 리드프레임 타입 패키지··························41
플라스틱 패키지 - 서브스트레이트 타입 패키지 ·················· 43
세라믹 패키지 ································································ 46
03. 웨이퍼 레벨 패키지························································· 47
웨이퍼 레벨 패키지 ························································· 47
재배선··········································································· 56
플립 칩·········································································· 58
04. 적층 패키지····································································· 66
패키지 적층 ··································································· 67
칩 적층 - Chip Stack with Wire Bonding··························· 70
실리콘 관통 전극 - Chip Stack with TSV ··························· 73
05. 시스템 인 패키지····························································· 86
04 반도체
패키지 설계와 해석
01. 반도체 패키지 설계 ·
